The replacement of traditional substrate materials with glass has been widely discussed! Through Glass Vias (TGV) in glass substrates, metal connections between upper and lower layers can transmit power and signals.

The advantages of glass carriers include excellent heat dissipation and high-frequency characteristics. Glass substrates not only have superior thermal conductivity, effectively dissipating heat, but also provide good electrical insulation and chemical stability, making them suitable for various high-temperature and corrosive environments. Additionally, their high-frequency properties make them perform exceptionally well in microwave and RF applications, helping to improve the performance and stability of semiconductor components.

Application

1. Multi-Chip Packaging (MCP): Glass interposers are used in multi-chip packaging to achieve efficient connections between different chips through precision via technology. This packaging method significantly enhances system integration and performance.
2. 3D Integrated Circuits (3D IC): In 3D IC technology, glass interposers serve as the vertical interconnect medium between different layers, offering high-density, high-performance connection solutions that support greater computing power and data processing speeds.
3. System-in-Package (SiP): System-in-Package technology requires interposers to support complex signal and power transmission. The high-frequency characteristics and excellent thermal management of glass substrates make them an ideal choice for SiP applications.
4. Radio Frequency (RF) Applications: In RF applications, glass substrates' low dielectric loss and high-frequency characteristics enable effective handling of high-frequency signals, thereby enhancing RF system performance.
5. High-Performance Computing (HPC): In the high-performance computing field, glass interposers can be used to create high-density interconnect layers, supporting ultra-high-frequency computing requirements and improving system processing speed and efficiency.
6. Display Technology: Glass substrates are widely used in liquid crystal displays (LCDs) and organic light-emitting diode (OLED) displays, providing stable structural support and optical performance that are crucial for high-resolution and large-sized displays.

As technology continues to advance and market demands diversify, the importance of glass substrates in future industry sectors will become increasingly prominent. Mastering and applying the advanced characteristics of glass substrates will be key to future success.

With over 40 years of experience in the glass industry, Hony Glass Technology is deeply committed to professional glass technology and extensive knowledge. We are dedicated to providing high-quality glass products and customized solutions to meet the needs of customers across various industries. Through advanced production equipment and stringent quality management, we ensure that every piece of glass product meets the highest standards, creating greater value for our customers. For more information of glass substrate for semiconductor packaging, please feel free to contact us.