Through Glass Via (TGV) is a technology for creating hole structures in glass substrates, providing vertical electrical connections. These holes can be categorized as through vias or blind vias. This technology enables glass substrates to be used in various high-density packaging applications. Through these vias, electrical power and signal transmission between metal layers are facilitated. Additionally, TGV offers excellent thermal performance, effectively dissipating heat generated by electronic components.
The aspect ratio is the ratio between the diameter of a hole and its depth, which is a crucial parameter in the design and manufacturing of glass vias. Hony Glass Technology has advanced capabilities in TGV and etching processes. If you have any needs, please feel free to contact us.
- Original hole diameter: 2 μm
- Etching hole: 50 μm
Through the integration of augmented reality (AR) technology with glass processing, modern technology reaches new milestones, serving as a crucial visual component for AR applications. Advancing the polishing process to a higher level enhances glass flatness, achieving greater precision and higher image fidelity.
Glass Polishing＆LappingGlass CuttingAR Coating
The application of glass is particularly important in virtual reality. Superior optical quality and high-specification strengthened cover glass ensure that users have a safe and optimal visual experience in virtual environments. If you require further understanding of the applications of glass in virtual reality, feel free to contact us, and we will be dedicated to serving you!
Glass Polishing＆LappingGlass CuttingAR Coating
